|SILICON INGOT TO BEAM||No residue after removing. Flexible curing conditions|
|BEAM TO WORK PLATE||Easy removable at low temperature. Fast curing at RT|
For Ingot bonding technology, especially in solar industry, PROTAVIC provides easy removable adhesives for temporarily bonding. The process of slicing the ingot involves adhering two or more ingot blocks onto a beam (in glass for instance) and then mounting the joined blocks onto the wire sawing equipment (work plate).
Afterwards, the wafers can be debonded without leaving any residue, in baths of hot water.
|PROTAVIC®||FUNCTION||CHEM.||VISCOSITY AT 5 RPM (MPA.S)||DIE SHEAR STRENGH @ RT||GEL TIME||CURING SCHEDULE||REMARKS||STORAGE|
|PROTAVIC® ANE 44036 A&B||Beam to work plate||Epoxy||32000||2000 PSI||5 min @20°C||1 hour @ 20°C||DSC PEAK 100°C||1 year @20°C|
|PROTAVIC® ANE 54807 M1 A&B||Silicon Ingot sawing||Epoxy||80000||26.5 kg||15 min @20°C||10 mn @80°C
3 hours @ 20°C
|Removing in 1 hour @70°C||1 year @20°C|