Semi-conductors

Blue silicon wafer

Technologies Advantages
DIE ATTACH
ELECTRO-CONDUCTIVE Low modulus Low Tg for thin die applications
High thermal conductivity
Spacer versions available for controlled bondline
NON ELECTRO-CONDUCTIVE Fast cure low modulus nonbleed
B-STAGEABLE Improved bondline control. Alternative to film adhesives
DAM & FILL GLOB TOP ENCAPSULANTS High Tg. Low CTE materials for improved thermal cycling performance

DIE ATTACH

Typical Application

The die attach process involves afxing silicon die or chips to a lead frame or other substrate with adhesive, either electrically conductive, or dielectric. PROTAVIC ofers a range of adhesive pastes specifically designed for this application. The die attach materials have been designed, using diferent chemistries depending the end application and requirements. Our portfolio for die attach includes epoxies, acrylics, polyimides, as well as hybrids. As such, we can ofer high thermally conductive die attach adhesives, very fast curable adhesives, flexible die attach adhesives with low E-modulus, etc.

Our portfolio also covers B-stageable materials, which are an alternative for traditional dispensible die-attach adhesives, and are a economical alternative to expensive film adhesives.

ELECTRO CONDUCTIVE PROTAVIC® CHEM . VISCO SITY AT 5 RPM (mPa.s) ELECT. RESIST . (mΩ.cm) TG (°C) STORAGE COND. POT LIFE AT 20±2 °C CURING SCHEDULES CTE (ppm/°C) YOUNG MODULUS
PROTAVIC ® ACE 30032 Epoxy 8000 0.1 80- 100 6 months@ -20°C 1 day 60 min@ 50°C  100
PROTAVIC ® ACA 20510 Acrylic 10000 0.1 37 6 months@ -40°C >1 day 30 min@200°C 4.6 Gpa@25° C 0.8 Gpa@100°C
1.8 Gpa@150°C
PROTAVIC ® ACE 34560 Epoxy 19000 0.0064 140 6 months@ -20°C 2 days 70 min@80° C
20 min@130 °C
44 3090MPa @25°C
438MPa@ 250°C
PROTAVIC ® ACE 24530 Epoxy 9175 0.35 78 1 year@-40°C 1 day 15min @175°C 5*10-5 2615MPa @25°C
222MPa@ 250°C
PROTAVIC ® ACE 24814 Epoxy 7800 0.06 93 1 year @-40°C 2 days 15min @175°C 65 4815 MPa@25° C
595MPa@ 100°C
274MPa@ 250°C
PROTAVIC ® ACE 14070 Epoxy 10000 0.088 75 1 year@-40°C 1 day 50 sec @200°C
(in-line snap cure oven)
63 2339MPa @25°C
PROTAVIC ® ACE 14050 Epoxy 7864 0.114 78 1 year@-40°C 36 hrs 72 sec@200 °C (in- line snap cure oven)
30min@1 75°C
58 8.6 Mpa@25° C
PROTAVIC ® ANH 20142 Hybrid 8500 1 year@-20°C 1 day 30min@150°C15mn@175°C 25 max
PROTAVIC ® ACE 30100 Epoxy 7000 110 6 months @-20°C 7 days 60min @120°C 30 max
PROTAVIC ® ANE 10713 Epoxy 11000 110 6 months@5°C 1 month 10 sec @170°C
40 sec@150°
25 max 7 GPa@25° C
2.5 GPa@ 100°C
1GPa@150°C
PROTAVIC ® ACE 24054 Epoxy 11500 43 6 months@-20°C 1 day 30min@150 °C 20 max 2480MPa@25°C
26MPa@150°C
36MPa@250°C

B-Stageable epoxy for die attach

B-STAGEABLE PROTAVIC® CHEM. COLOR VISCOSITY* AT 5 RPM (mPa.s) TG (°C) STORAGE COND. POT LIFE AT 20±2° C CURING SCHEDULE HEGMANN FINENESS (micron) YOUNG MODULUS
PROTAVIC® BCE 20240 Epoxy silver 25000 65 1 year@0° C 1 month 30min@90°C
+30 min@ 180°C
2.7GPa @25°C
0.28GPa@2 50°C
PROTAVIC® BNE 20220 Epoxy black 30000 63 1 year@0° C 1 month 30min.@90°C
+30 min.@ 180°C
30 max

DAM/FILL & GLOB TOP

Typical Application

Dispensing a high-viscosity dam followed by a low-viscosity fill, will create a completed encapsulated package for your CSP, BGA and/or other semiconductor component.Dam-and-Fill materials improve the reliability of the package, and help in reducing warpage. As such, the components will resist to physical thermal stress, as well as improve resistance against moisture and chemicals.

Glob Top encapsulants have the same purpose as Dam & Fill materials. Where Dam & Fill encapsulants are typically used for larger die applications, Glob Top encapsulants are used in case of smaller chips. Our range covers materials with high Tg and low CTE.

DAM/FILL GLOB TOP PROTAVIC ® FUNCTION CHEM. VISCOSITY AT 5 RPM (mPa.s) TG (°C) CTE (ppm/°C) CURING SCHEDULES POT LIFE STORAGE
PROTAVIC ® PNE 30252 DAM Epoxy 105000 at 2rpm 140-150 2C 20 min@150°C 1 day 3 months@-20°C
PROTAVIC ® PNE 30270 GLOB TOP Epoxy 70000 125 20 30-40 min@125°C
1-2 min@175°C
5 days 3 months@-20°C
PROTAVIC ® PNE 30273 FILL Epoxy 22000 160-170 20 30-40 min@125°C
1-2 min@175°C
24 hrs 3 months@-20°C
PROTAVIC ® PNE 90595 DAM Epoxy 16000 24 140-150 30 sec @120mW/ cm2 UVA 5 days 6 months @5°C
PROTAVIC ® PNE 90295 FILL Epoxy 2700 57 125 30 sec @120mW/cm2 UVA 24 hrs 6 months @5°C
PROTAVIC ® PTS 46313 DAM Silicone 8000 below 0°C 30 min@ 125°C 24 Hrs 1 year @-40°C