Set Top Boxes

Technologies Advantages
ENCAPSULATION High thermal resistance  high mechanical strengh
UNDERFILL Low CTE  High Tg  small gap underfill

UNDERFILL

Typical Application

Underfill provides shock, drop, and vibration protection for electronic devices. PROTAVIC ofers capillary underfills suitable for protection of BGA’s components in Set Top Box technology.
Underfills improve the reliability of the solder connections, specifically under thermal stress and/or drop testing. Thermal stresses due to CTE mismatches are overcome, thanks to underfill encapsulants.

UNDERFILL PROTAVIC® VISCOSITY AT 5 RPM (mPa.S) TG (°C) CTE (ppm/°C) CURING SCHEDULES HEGMANN FINENESS (micron) POT LIFE STORAGE
PROTAVIC® ANE 10932 25000 140-150 25 3 min @150°C 8 3 Days 6 months@-40°C
PROTAVIC® ANE 10933 15000 125 32 10 min @150°C
60 min @ 125°C
12 3 Days 6 months @-20°C
PROTAVIC® ANE 20960 6000 160-170 17 5 min @65°C
20 min @150°C
100 5 Days 6 months @-20°C

ENCAPSULATION

Typical Application

PROTAVIC has developed encapsulants adhesives, electrically insulating, specially designed for protecting devices form heat, humidity and mechanical damages. Thanks to their excellent mechanical properties up to 260-300°C, they are recommended for Set Top Box application to prevent chip detaching.

ENCAPSULANT PROTAVIC® MIXING RATIO (BY WEIGHT) VISCOSITY AT 5 RPM (MPA.S) TG (°C) CTE (PPM /°C) LAP SHEAR STENGH @20°C STORAGE COND. POT LIFE AT 20±2°C CURING SCHEDULE
PROTAVIC® PNE 44051 A&B 2/1 30300 PartA
41300 Part B
91 35 >10 6 months @25°C 20-30 min 5 days @25°C
90min@50°C
PROTAVIC® PNE 44822 A&B 4/1 68000 Part A
25000 Part B
100 50 >5 3 months @25°C 20-30 min 2-7 days @25°C
2 hours@65°C