Smart Cards – R.F.I.D.

electronic chip

Technologies Advantages
DIE ATTACH Fast cure die attach adhesives
DAM/FILL & GLOB TOP UV-curable and/or thermal curable
Excellent bending test resistance
CONDUCTIVE INKS Printable conductive inks for low temperature substrates
DIELECTRIC INKS Fast curable UV inks with excellent adhesion on difficult to bond substrates

 

DIE ATTACH

Typical Application

The smart card and RFID markets are high volume markets where high throughputs are critical. As such, PROTAVIC has developed a range of fast cure materials; both for traditional die attach / wire bonding, as well as for newer stud bump flip chip attach processes

NON CONDUCTIVE PROTAVIC® COLOR VISCOSITY AT 5 RPM (mPa.s) TG (°C) CTE (ppm/°C) STORAGE COND. POT LIFE AT 20±2 °C CURING SCHEDULES HEGMANN FINENESS (micron) YOUNG MODULUS
PROTAVIC® ANE 10713 Off white 11000 110 95 6months s@5°C 1 month 1min@1 50°C 10sec.@ 170°C 25 max 7GPa@2 5°C 2.5GPa
@100°C 1GPa@1 50°C
PROTAVIC® ANE 30100 black 7000 110 55 6months s@-20° C 7 days 60min@ 120°C 5mn@1 50°C 30 max
PROTAVIC® ATE 10130 White 7500 75 1 year@-20°C 5 days 90min@ 75°C
5min@1 25°C
3min@1 40°C
25 max
PROTAVIC® ANE 17710 clear 3000@10rpm 165 3month s@-20° C 1 day 2min@ 120°C

DAM/FILL & GLOB TOP

Typical Application

Dispensing a high-viscosity dam followed by a low-viscosity fill, will create a completed encapsulated package for the smard card micromodule. Dam-and-Fill materials improve the reliability of the package, and help to reduce warpage, as well as protection during torsion and bending tests.

Glob Top encapsulants have the same purpose as Dam & Fill materials. Where Dam & Fill encapsulants are typically used for larger die applications, Glob Top encapsulants are used in case of smaller chips. Our range covers materials with high Tg and low CTE. For the high volume smart card market, PROTAVIC has ofered fast cure UV materials. But also for lower volume applications, thermally cured glob top, dam and/or fill encapsulants are ofered with high Tg and/or low CTE.

DAM/FILL GLOB  TOP PROTAVIC® FUNCTION CHEM. VISCOSITY AT 5 RPM (mPa.s) TG(°C) CTE (ppm/°C) CURING SCHEDULES POT LIFE  STORAGE
PROTAVIC® PNE 30251 GLOB TOP Epoxy 60000 95 35 min@125°C
+1 hr@175°C
8 Hrs 6 months@
25°C
PROTAVIC® PNE 30252 DAM Epoxy 105000@ 2rpm 140
-150
24 20 min@150°C 1 day 3 months@-20°C
PROTAVIC® PNE 30270 GLOB TOP Epoxy 70000 125 20 30-40 min@125°C
1-2 min@175°C
5 days 3 months@-20°C
PROTAVIC® PNE 30273 FILL Epoxy 22000 160
– 170
20 30-40 min@125°C
1-2 min@175°C
24 Hrs 3 months@-20°C
PROTAVIC® PNE 90593 DAM Epoxy 17000 73 115 30 sec@120mW/ cm2 UVA 5 days 6 months@5°C
PROTAVIC® PNE 90293 FILL Epoxy 3000 68 115 30 sec@120mW/ cm2 UVA 1 day 6 months@5°C
PROTAVIC® PNE 90595 DAM Epoxy 16000 140 -150 24 30 sec@120mW/ cm2 UVA 5 days 6 months@5°C
PROTAVIC® PNE 90295 FILL Epoxy 2700 125 57 30 sec@120mW/ cm2UVA 1 day 6 months@5°C
PROTAVIC® PNE 90397 GLOB TOP Epoxy 7500 100 30 60 sec@120mW/ cm2 UV <5 days 1 year@5°C

CONDUCTIVE INKS

Typical Application

RFID antennas are often printed by stencil printing on low temperature substrates such as paper, Teslin, PET and/or PVC. For those applications, PROTAVIC has developed a range of low temperature cure conductive inks. These combine flexibility with good conductivity, making them ideally suitable for applications such as RIFD antennas.

CONDUCTIVE INKS PROTAVIC® CHEM. ELECTRICAL RESISTIVITY (mΩ.cm) VISCOSITY
AT 5 RPM (mPa.s)
THICKNESS TG (°C) CURING SCHEDULES STORAGE COND. POTLIFE AT 20±2°C
PROTAVIC® VCO 60100 Polyester 0.05 2500 8 to 12 microns Below20 °C 15min@80° C
2mn@120° C
1 year @25°C 1 year @25°C
PROTAVIC® VCO 60101 Polyester 0.03 20000 8 to 12 microns <0°C 10min@125°C 6 months @10°C 1 month
PROTAVIC® VCO 60130 Polyester 0.07 25000 5 to 15 microns 10min@80° C
2min@120° C
1 year @25°C 1 year @25°C
PROTAVIC® BCE 37611 Epoxy 0.3 7000@10rpm 2min@120° C 6 months@-20°C 1 day

 DIELECTRIC INK

Typical Application

Also the dielectric UV-curable inks which are used for making dielectric layers, in between conductive layers are ofered by PROTAVIC. We are diferentiated from other vendors by higher curing speeds, better adhesion on difcult to bond substrates, as well as the possibility to realize appropriate layer thicknesses in less printing steps compared to traditional inks.

DIELECTRIC INK PROTAVIC® CHEM. COLOR VISCOSITY* AT 5 RPM (mPa.s) STORAGE COND. POT LIFE AT 20±2°C CURING SCHEDULE ELONGATION ON BREAK (%) DIELECTRIC STRENGH (KV/mm)
PROTAVIC® PNU 90250 Urethane blue 5000 6 months@25°C 2 days <10 sec with high pressure mercury vapor lamp 20 >10