DIE ATTACH

Typical Application

The smart card and RFID markets are high volume markets where high throughputs are critical. As such, PROTAVIC has developed a range of fast cure materials; both for traditional die attach / wire bonding, as well as for newer stud bump flip chip attach processes

DAM/FILL & GLOB TOP

Typical Application

Dispensing a high-viscosity dam followed by a low-viscosity fill, will create a completed encapsulated package for the smard card micromodule. Dam-and-Fill materials improve the reliability of the package, and help to reduce warpage, as well as protection during torsion and bending tests.

Glob Top encapsulants have the same purpose as Dam & Fill materials. Where Dam & Fill encapsulants are typically used for larger die applications, Glob Top encapsulants are used in case of smaller chips. Our range covers materials with high Tg and low CTE. For the high volume smart card market, PROTAVIC has ofered fast cure UV materials. But also for lower volume applications, thermally cured glob top, dam and/or fill encapsulants are ofered with high Tg and/or low CTE.

CONDUCTIVE INKS

Typical Application

RFID antennas are often printed by stencil printing on low temperature substrates such as paper, Teslin, PET and/or PVC. For those applications, PROTAVIC has developed a range of low temperature cure conductive inks. These combine flexibility with good conductivity, making them ideally suitable for applications such as RIFD antennas.

 DIELECTRIC INK

Typical Application

Also the dielectric UV-curable inks which are used for making dielectric layers, in between conductive layers are ofered by PROTAVIC. We are diferentiated from other vendors by higher curing speeds, better adhesion on difcult to bond substrates, as well as the possibility to realize appropriate layer thicknesses in less printing steps compared to traditional inks.