Thermal dissipation

Attaching heat-generating components to electronic assemblies requires thermally conductive adhesives to avoid creating hot spots.

In addition, the miniaturization and increased power density of electronic components has led to higher temperatures, further increasing the demand for thermally conductive, heat dissipating materials.

The PROTAVIC product line meets the need for heat dissipation through thermally conductive pottings designed for optimal heat transfer.

Some examples are listed in the table below.

Technical description