PROTAVIC ANE 10932 Non conductive underfill for BGA packages assembly.
PROTAVIC ANA 10710 Skip cure non conductive hybrid adhesive with high reliability, low modulus and low stress for die-attach on to plastic substrates for smart Cards.
PROTAVIC ACE 30512 Soft solder replacement,high thermal conductive epoxy die-attach on to lead frame with high adhesion and conductivity after exposure to multiple reflows under humid conditions.
PROTAVIC BCE 30380 B stageable termination adhesive for small sizes capacitors and resistors with low evaporation properties able to have a constant viscosity on line.