Die-Attach

The Die-Attach process involves attaching a silicon chip to a lead frame or other substrate with an adhesive that is either electrically conductive or dielectric. PROTAVIC offers a range of adhesives specially designed for this purpose.

The choice of the chemistry depends on the final application and requirements:

  • epoxies,
  • acrylics,
  • polyimides
  • or hybrids.

PROTAVIC offers Die-Attach adhesives with high thermal conductivity, quick curing, very low CTE and low outgassing.

Some examples are listed in the table below.

Technical description

Name

Color

Chemistry

Density

Viscosity at 25°C (mPa.s)

Glass transition temperature (TG)

CTE (ppm/°C)

Shore hardness

Thermal conductivity (W/(m.K))

Electrical resistance (mΩ.cm)

Percent load

Open time

Polymerization / Crosslinking

Storage

PROTAVIC® ACA 20513

Silver

Acrylate

4.4

9500

55°C

-

D70

>18

<0.1

-

24 hours

30 min at 200°C

3 months at -20°C

PROTAVIC® ACC 20700

Silver

Cyanate ester

4

10000

210°C

33

-

4.1

<5

80

20 hours

30 min at 150°C

1 year at -40°C

PROTAVIC® ANE 30100

Black

Epoxy

1.2

7000

115°C

55

-

-

-

-

7 days

60 min at 120°C

6 months at -20°C

PROTAVIC® ACA 20513

Silver

Acrylate

Chemistry

4.4

Density

9500

Viscosity at 25°C (mPa.s)

55°C

Glass transition temperature (TG)

-

CTE (ppm/°C)

D70

Shore hardness

>18

Thermal conductivity (W/(m.K))

<0.1

Electrical resistance (mΩ.cm)

-

Percent load

24 hours

Open time

30 min at 200°C

Polymerization / Crosslinking

3 months at -20°C

Storage

PROTAVIC® ACC 20700

Silver

Cyanate ester

Chemistry

4

Density

10000

Viscosity at 25°C (mPa.s)

210°C

Glass transition temperature (TG)

33

CTE (ppm/°C)

-

Shore hardness

4.1

Thermal conductivity (W/(m.K))

<5

Electrical resistance (mΩ.cm)

80

Percent load

20 hours

Open time

30 min at 150°C

Polymerization / Crosslinking

1 year at -40°C

Storage

PROTAVIC® ANE 30100

Black

Epoxy

Chemistry

1.2

Density

7000

Viscosity at 25°C (mPa.s)

115°C

Glass transition temperature (TG)

55

CTE (ppm/°C)

-

Shore hardness

-

Thermal conductivity (W/(m.K))

-

Electrical resistance (mΩ.cm)

-

Percent load

7 days

Open time

60 min at 120°C

Polymerization / Crosslinking

6 months at -20°C

Storage

For more information, see the brochure:

Leaflet printed card